SJ/T 11993-2025 specifies the test procedure, result expression and test report requirements for pad cratering of printed circuit board assemblies.

The method uses a pull-pin to form a solder ball on its tip, joints the ball to a target pad through reflow heating, then pulls the pin vertically to obtain a pad force-time curve, enabling evaluation of pad anti-cratering strength on rigid PCBs and assemblies.

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